@misc{65f31191c2994557828a8ef0d16bf5a4,
title = "ELECTRODEPOSITION OF COBALT TUNGSTEN FILMS",
author = "A, \{Spurlin Tighe\} and C, \{Opocensky Edward\} and Feng Zhange and A, \{Rigsby Matthew\} and David, \{Reid Jonathan\} and Zhange Feng",
note = "Tungsten-containing metal films may be deposited in recessed features of semiconductor substrates by electrodeposition. The tungsten-containing metal film is electrodeposited under conditions so that the tungsten-containing metal film is free or substantially free of oxide. Conditions are optimized during electrodeposition for pH, tungsten concentration, and current density, among other parameters.",
year = "2020",
month = dec,
day = "30",
language = "American English",
type = "Other",
}